D-Sub高密度連接器AMPHENOL
發布時間:2023-09-06 16:40:00 瀏覽:736
AMPHENOL的D-Subminiature高密度產品系列為線路板和電纜線末端提供各種線接選擇,明顯減少了電纜組件和連接器整體成本。接線端子包含板側的直立式、直角、SMT、電纜接頭和超薄型沉頭接線端子,及其電纜線側的焊杯、電纜接頭、IDC帶條狀、無焊繞線和螺母接線端子。各個線接規格都有插座和插頭連接器。
D-Sub高密度連接器直角PCB線接有兩種封裝格局款式:歐洲規劃和軍工用格局。搭配板塊接觸表面始終為金黃色,能根據所需要的充足搭配頻率選擇三種基本板厚:閃光金、15μ"和30μ"。接觸點能夠提供精密機械加工的軍工用級版本(額定電流高至7.5A)以保障安全可靠性,也能夠提供更經濟且可商用的額定電流為3A的沖壓版本。
D-Sub高密度連接器標準系列常從A到E的5種基本機殼規格,AMPHENOL的混合連接器在數據信號、電源和同軸電纜方面具有高達18個接觸點排列。堆疊(雙端口)D-Sub高密度連接器產品系列相當豐富。AMPHENOL新開發的用作PIP焊接細長(或沉式或短型)系列在AMPHENOL的商業客戶中獲得成功。除此之外,AMPHENOL還可以為所有應用提供設備,包含金屬蓋、塑料防塵蓋、保護罩、組裝設備、性別轉換和其它適配器。
特征
標準D形連接器
EMI金屬外殼
插頭接地裝置凹坑
插進件由阻燃熱塑性塑料制作而成
應用商業公章接觸點
具備全方位線接范圍的變體
各種線接規格均提供插座和插頭
優勢
確保正確的配合方位
主要用于批量生產但降低成本的解決方案
UL#E232356認證
兼容各種用戶需求
符合標準規范
特殊系列適合于管腳焊錫膏或回流焊接
深圳市立維創展科技代理經銷AMPHENOL公司各個領域產品系列,在AMPHENOL,AMPHENOL相信在開展業務的過程中做出可持續的選擇可以為股東創造短期和長期價值。AMPHENOL的每一項業務都致力于不斷改進其設計,采購,制造和交付產品的方式,努力滿足或超越客戶對整個價值鏈中產品管理的期望。AMPHENOL 的業務將安全和環境保護作為首要任務,并根據ISO 14001和OHSAS 18001等公認標準管理這些計劃。但是,認證和法律合規性還不夠。AMPHENOL不僅僅遵守法規就能創造長期價值。
詳情了解AMPHENOL可點擊:http://www.liaoyuan999.com/article/1321.html
PART NUMBER | DESCRIPTION |
G17DC15023313HR | Dsub Slim Right Angle Dip, High Density 15 Position Receptacle VGA, Sunk 4.27mm, 15μin Au, Footprint 1.6mm, 2 Rows, Pitch 1.0mm, Post distance 1.4mm, PCB hole distance 2.3mm, Tail 3.05mm, Tape and Reel with Cap, Blue 661C, PIP, Halogon Free |
G17DD1504232GHR | G17DD1504232GHR-Slim Right Angle Dip HD 15P Receptacle |
G17DD1504232RHR | G17DD1504232RHR-Slim Right Angle Dip HD 15PReceptacle |
G17DD1504232SHR | G17DD1504232SHR-Slim Right Angle Dip HD 15P Receptacle |
L177HDA26S | Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock |
L177HDA26SD1CH3F | Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock |
L177HDA26SD1CH3R | Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Ground Tab, With Boardlock |
L177HDA26SD1CH4F | Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock |
L177HDA26SD1CH4R | Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock |
L177HDA26SOL2 | Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock |
L177HDA26SVF | Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock |
L177HDAG26S | Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock |
L177HDAG26SOL2RM5 | Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165") |
L177HDAG26SOL2RM8 | Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165") |
L177HDAH26SOL2 | Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock |
L177HDAH26SOL2RM5 | Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Insert, 4-40 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165") |
L177HDAH26SOL2RM8 | Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165") |
L177HDAH26SVF | Dsub, Stamped Signal 3A, Straight Soldercup, 26 Socket, Bright Tin Shell, 0.38m (15 in) Gold, 4-40 Removable Front Screwlock, 4-40 Threaded Nut |
L177HDB44S | Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock |
L177HDB44SD1CH3F | Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock |
L177HDB44SD1CH4F | Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock |
L177HDB44SD1CH4R | Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock |
L177HDB44SOL2 | Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock |
L177HDB44SVF | Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock |
推薦資訊
深圳市立維創展科技有限公司,是美國THUNDERLINE-Z & Fusite品牌在中國的授權渠道商,其金屬玻璃密封端子,已廣泛應用于航天、軍事、通信等高可靠性領域。
MASW-011098 是 MACOM 推出的高功率 Ka 波段 SPDT PIN 二極管開關,工作頻率 26 - 40GHz,低插入損耗、高隔離度,功率處理能力強,切換快,采用 5mm×5mm 20 引腳封裝,符合 RoHS 標準,適用于 5G 基建等,在航空航天、5G 通信、測試測量等領域應用廣泛。