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D-Sub高密度連接器AMPHENOL

發(fā)布時(shí)間：2023-09-06 16:40:00 瀏覽：949

AMPHENOL的D-Subminiature高密度產(chǎn)品系列為線路板和電纜線末端提供各種線接選擇，明顯減少了電纜組件和連接器整體成本。接線端子包含板側(cè)的直立式、直角、SMT、電纜接頭和超薄型沉頭接線端子，及其電纜線側(cè)的焊杯、電纜接頭、IDC帶條狀、無焊繞線和螺母接線端子。各個(gè)線接規(guī)格都有插座和插頭連接器。

D-Sub高密度連接器直角PCB線接有兩種封裝格局款式：歐洲規(guī)劃和軍工用格局。搭配板塊接觸表面始終為金黃色，能根據(jù)所需要的充足搭配頻率選擇三種基本板厚：閃光金、15μ"和30μ"。接觸點(diǎn)能夠提供精密機(jī)械加工的軍工用級(jí)版本（額定電流高至7.5A）以保障安全可靠性，也能夠提供更經(jīng)濟(jì)且可商用的額定電流為3A的沖壓版本。

D-Sub高密度連接器標(biāo)準(zhǔn)系列常從A到E的5種基本機(jī)殼規(guī)格，AMPHENOL的混合連接器在數(shù)據(jù)信號(hào)、電源和同軸電纜方面具有高達(dá)18個(gè)接觸點(diǎn)排列。堆疊（雙端口）D-Sub高密度連接器產(chǎn)品系列相當(dāng)豐富。AMPHENOL新開發(fā)的用作PIP焊接細(xì)長（或沉式或短型）系列在AMPHENOL的商業(yè)客戶中獲得成功。除此之外，AMPHENOL還可以為所有應(yīng)用提供設(shè)備，包含金屬蓋、塑料防塵蓋、保護(hù)罩、組裝設(shè)備、性別轉(zhuǎn)換和其它適配器。

特征

標(biāo)準(zhǔn)D形連接器

EMI金屬外殼

插頭接地裝置凹坑

插進(jìn)件由阻燃熱塑性塑料制作而成

應(yīng)用商業(yè)公章接觸點(diǎn)

具備全方位線接范圍的變體

各種線接規(guī)格均提供插座和插頭

優(yōu)勢

確保正確的配合方位

主要用于批量生產(chǎn)但降低成本的解決方案

UL#E232356認(rèn)證

兼容各種用戶需求

符合標(biāo)準(zhǔn)規(guī)范

特殊系列適合于管腳焊錫膏或回流焊接

深圳市立維創(chuàng)展科技代理經(jīng)銷AMPHENOL公司各個(gè)領(lǐng)域產(chǎn)品系列，在AMPHENOL，AMPHENOL相信在開展業(yè)務(wù)的過程中做出可持續(xù)的選擇可以為股東創(chuàng)造短期和長期價(jià)值。AMPHENOL的每一項(xiàng)業(yè)務(wù)都致力于不斷改進(jìn)其設(shè)計(jì)，采購，制造和交付產(chǎn)品的方式，努力滿足或超越客戶對(duì)整個(gè)價(jià)值鏈中產(chǎn)品管理的期望。AMPHENOL 的業(yè)務(wù)將安全和環(huán)境保護(hù)作為首要任務(wù)，并根據(jù)ISO 14001和OHSAS 18001等公認(rèn)標(biāo)準(zhǔn)管理這些計(jì)劃。但是，認(rèn)證和法律合規(guī)性還不夠。AMPHENOL不僅僅遵守法規(guī)就能創(chuàng)造長期價(jià)值。

詳情了解AMPHENOL可點(diǎn)擊：http://www.liaoyuan999.com/article/1321.html

PART NUMBER	DESCRIPTION
G17DC15023313HR	Dsub Slim Right Angle Dip, High Density 15 Position Receptacle VGA, Sunk 4.27mm, 15μin Au, Footprint 1.6mm, 2 Rows, Pitch 1.0mm, Post distance 1.4mm, PCB hole distance 2.3mm, Tail 3.05mm, Tape and Reel with Cap, Blue 661C, PIP, Halogon Free
G17DD1504232GHR	G17DD1504232GHR-Slim Right Angle Dip HD 15P Receptacle
G17DD1504232RHR	G17DD1504232RHR-Slim Right Angle Dip HD 15PReceptacle
G17DD1504232SHR	G17DD1504232SHR-Slim Right Angle Dip HD 15P Receptacle
L177HDA26S	Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
L177HDA26SD1CH3F	Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock
L177HDA26SD1CH3R	Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Ground Tab, With Boardlock
L177HDA26SD1CH4F	Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock
L177HDA26SD1CH4R	Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock
L177HDA26SOL2	Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
L177HDA26SVF	Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock
L177HDAG26S	Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock
L177HDAG26SOL2RM5	Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")
L177HDAG26SOL2RM8	Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")
L177HDAH26SOL2	Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock
L177HDAH26SOL2RM5	Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Insert, 4-40 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")
L177HDAH26SOL2RM8	Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")
L177HDAH26SVF	Dsub, Stamped Signal 3A, Straight Soldercup, 26 Socket, Bright Tin Shell, 0.38m (15 in) Gold, 4-40 Removable Front Screwlock, 4-40 Threaded Nut
L177HDB44S	Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
L177HDB44SD1CH3F	Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock
L177HDB44SD1CH4F	Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock
L177HDB44SD1CH4R	Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock
L177HDB44SOL2	Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
L177HDB44SVF	Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock

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